New 'Qualcomm Mobile' to feature Rebranded Tier-200 Chips





Qualcomm has decided introduce a new naming structure. The company has announced that Snapdragon branding will now apply only to premium processors. Whereas those in the 200 tier will be rebranded under the new “Qualcomm Mobile” brand.




In order to differentiate their value, the chip giant has also decided to move away from processor branding towards “platforms”.



Qualcomm to Rebrand 200-Tier Chips Under the New ‘Qualcomm Mobile’ Brand




















In a blog post Qualcomm revealed that,
“Moving forward, only premium mobile platforms will retain the Snapdragon brand, while processors in the 200 tier will fall under the new Qualcomm Mobile name.”

The post further added,
“Our belief is that bringing the 200-level mobile platforms under the new Qualcomm Mobile brand will help differentiate entry-level and high-volume solutions from our flagship and high-end Snapdragon premium mobile experience platforms. Our goal is to create better clarity and expectations for our customers.”

According to Qualcomm, this renaming will permit it to better manifest the purchases it has made to enhance its place as a semiconductor player. And also express that it has moved from mobile devices into such sectors as connected cars, mobile PCs, servers, IoT, wearables, drones, VR, and AR.

Qualcomm decides to introduce a new naming structure


Qualcomm said,
“The word [processor] is an inadequate representation of what the technology actually is, and the solutions that tens of thousands of Qualcomm Technologies innovators have worked on.”

Snapdragon is much more than a single component, a piece of silicon, or what many would misunderstand as the CPU. Instead it’s a compilation of technology, consisting of hardware, software. And facilities that are not fully hooked in a word like ‘processor’. This is the reason why Qualcomm Technologies is clarifying the terminology. It can be done by relating to Snapdragon as a platform rather than a processor.

The recent Snapdragon platform was introduced in November. The 835 family was designed in collaboration with Samsung using the latter’s 10-nanometer (nm) FinFET process technology. That offers a surge of almost 30% in area efficiency, a 27% performance boost, and a 40% decline in power consumption.

The Snapdragon 835 is smaller and higher powered than any of its predecessors, Vice President of Product Management Keith Kressin said.
“Using the new 10nm process node is expected to allow our premium tier Snapdragon 835 processor to deliver greater power efficiency. And increase performance while also allowing us to add a number of new capabilities. That can improve the user experience of tomorrow’s mobile devices.”

Kressin said.

It is being anticipated that the Snapdragon 835 is to ship commercially in devices during the first half of 2017.












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